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vfhd1111c - 3b72b - tr 2012.12.28 page : 1 features 1608 (h=0.7mm) type, diffused resin ? outer dimension 1.6 x 0.8 x 0.7mm ( l x w x h ) ? lead C free soldering compatible ? rohs compliant ? corresponds to jedec/ipc j - std - 020 msl 3 ? as for this product, the part number listed in the catalog had been changed because of renewed narrower spec. (vfhd1111c - tr vfhd1111c - 3b72b - tr ) package product features ? light source of indicator for automotive, cluster meter, car audio and hvac, etc. standard product specifications recommended applications
vfhd1111c - 3b72b - tr page : 2 unit mm weight 1.40mg tolerance 0.1 outline dimensions recommended pad 2012.12.28 unit mm symbol part name material qty. led die algainp 1 lens epoxy resin 1 substrate glass fabrics 1
vfhd1111c - 3b72b - tr page : 3 specifications 2012.12.28 continuous forward current v i f 1.00 ma/ item symbol maximum ratings units mw storage temperature t stg absolute maximum ratings i f 30 ma i frm 3.33 ma/ 78 algainp yellow-green product overview resin cokor emitting area die material emitting cokor (ta=25) power dissipation p d i frm derate linearly from ta=75 milky white i frm 100 t opr reverse voltage v r 5 -40 +100 ma operating temperature -40 +105 i f derate linearly from ta=75 repetitive peak forward current pulse width 1ms, duty 1/20 note1 note2 electrostatic discharge threshold"hbm" esd 1,000 v solderingtemperature "reflow soldering" t sld 260 note 1 note 2 esd testing method : eiaj4701/300(304) human body model(hbm) 1.5k ,100pf please refer to page 8, soldering conditions. units symbol note3 /w 105 350 thermal characteristics (ta=25) ?pcbfr4t=1.6mm) /w max. typ. 550 thermal resistance junctionambient temp. thermal resistance junctionsolder point junction temp. items ?pad size16mO note3 r th(j-a) condition r th(j-a) r th(j-s) tj
vfhd1111c - 3b72b - tr page : 4 notes above luminous intensity (i v ) values and dominant wavelength ( d) values are the setup value of the selection machine. tolerance : i v 10%, d 1nm specifications 2012.12.28 i v (mcd) b9 47 56 c leds shall be sorted out into the following ranks of luminous intensity and dominant wavelength. 33 min. b7 max. luminous intensity (iv) rank rank rank dominant wavelength ( d) rank d (nm) min. max. sorting for luminous intensity and dominant wavelength i f =20ma ta=25 conditions conditions 39 i f =20ma ta=25 b b8 39 47 573 576 570 573 i f = 20ma - - 33 i f = 20ma - units 570 10 - 576 572 15 - i f = 20ma v v f 2.4 (ta=25) i f = 20ma conditions tolerance i v 10% d 1nm note forward voltage min. typ. max. 1.9 items symbol i f = 20ma i r i f = 20ma i v p reverse current luminous intensity peak wavelength v r = 5v luminous flux 575 nm a - mcd 43 nm 56 - - deg. dominant wavelength spectral line half width nm electrical and optical characteristics above luminous intensity (i v ) values and dominant wavelength ( d) values are the setup value of the selection machine d half intensity angle 2 1/2 - ? 140 v i f = 20ma - 130 - mlm
vfhd1111c - 3b72b - tr 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 380 430 480 530 580 630 680 730 780 relative intensity vs. wavelength conditions : ta = 25 , i f = 20ma wave l ength : ( nm ) page : 5 technical data spatial distribution example conditions: ta = 25 , i f =20ma relative radiant intensity : (%) relative intensity - - - direction DD direction x y 2012.12.28 0 10 20 30 40 50 60 70 80 90 100 -100 -80 -60 -40 -20 0 20 40 60 80 100 x-direction y-direction 10 20 30 40 60 80 70 90 50 0 10 20 30 40 50 60 70 80 90
vfhd1111c - 3b72b - tr 1 10 100 1.6 1.7 1.8 1.9 2.0 2.1 condition : ta = - 20 to 85 85 25 60 - 20 0 forward voltage vs. forward current forward voltage : v f (v) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 5 10 15 20 25 30 ci forward current vs. relative intensity condition : ta = 25 forward current : i f (ma) 0.1 1.0 10.0 -40 -20 0 20 40 60 80 100 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 -40 -20 0 20 40 60 80 100 120 i f =2ma i f =5ma i f =10ma i f =20ma i f =30ma page : 6 technical data ambient temp. vs forward voltage condition : i f = 2ma to 30ma forward current i f (ma ) relative intensity forward voltage v f (v) ambient temp.:ta ( ) ambient temp. vs relative intensity condition : i f = 20ma ambient temp.:ta ( ) relative intensity 2012.12.28
vfhd1111c - 3b72b - tr 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 duty=5% duty=10% duty=20% duty=50% dc ambient temperature vs. max . forward current repetition frequency : f R 50hz pulse width: tw Q 1ms ambient temperature: ta ( ) 564 566 568 570 572 574 576 578 580 -40 -20 0 20 40 60 80 100 569 570 571 572 573 574 0 5 10 15 20 25 30 ci forward current vs. dominant wavelength condition: ta = 25 forward current: i f (ma) ambient temperature vs. dominant wavelength condition : i f = 20ma ambient temperature: ta ( ) 1 10 100 1 10 100 duty cycle vs. max . forward current condition : ta = 25 duty cycle: (%) page : 7 dominant wavelength : d (nm) maximum forward current : i fmax . (ma) dominant wavelength : d (nm) maximum forward current : i fmax . (ma) technical data 2012.12.28
vfhd1111c - 3b72b - tr page : 8 soldering condition 1. heat stress during soldering will influence the reliability of leds, however that effect will vary on heating method. also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount led). 2. led parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials . 3. recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. temperature distribution varies on heating method, pcb material, other components in the assembly, and mounting density. please do not repeat the heating process in reflow process more than twice. note 1 recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. this should be the maximum temperature for soldering. lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability . note 2 the reflow soldering process should be done up to twice(2 times max). when second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of led. the second soldering process should not be done until leds have returned to room temperature (by nature - cooling) after first soldering process. soldering precaution ( acc.to eiaj - 4701/300 ) 2014/7/16 page : 8 recommended reflow soldering condition 40sec max. 150 180 +1.5 +5 /s 260 max. - 1.5 - 5 /s 90~ 120sec max. pre - heating (soldering 230 max. peak temperature
vfhd1111c - 3b72b - tr page : 9 soldering condition 4. if soldering manually, stanley recommends using a soldering iron equipped with temperature control. during the actual soldering process , make sure that the soldering iron never touch the led itself, and avoid the led's electrode heating temperature reaching above the heating temperature of the solder pad. all repairs must be performed only once in the same spot, and please avoid reusing components. 5. in soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature before using. also, please avoid applying any type of pressure to the soldered components before the solder has been cooled and hardened, as it may deteriorate solder performance and solder quality. 6. when using adhesive material for tentative fixatives, thermosetting resin or ultraviolet radiation (uv) setting resin with heat shall be recommended . the curing condition, temperature:150 max./time:120sec.max. 7. flow soldering (dip soldering) is not recommended for this product . 8. lsopropyl alcohol is recommended for cleaning. some chemicals, including freon substitute detergent could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. please review the reference chart below for cleaning. if water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the component before using. recommended manual soldering condition temperature of iron tip 350 max. soldering duration, time 3sec.max.,1 time chemical adaptability isopropyl alcohol trichloroethylene chlorothene acetone thinner 2014/7/16 page : 9
vfhd1111c - 3b72b - tr page : 10 handling precaution other precautions 1. stanley led lamps have semiconductor characteristics and are designed to ensure high reliability. however, the performance may vary depending on usage conditions 2. absolute maximum ratings are set to prevent led lamps from failing due to excess stress ( temperature , current, voltage, etc .). usage conditions must not exceed the ratings for a moment, nor do reach one item of absolute maximum ratings simultaneously . 3. in order to ensure high reliability from led lamps, variable factors that arise in actual usage conditions should be taken into account for designing. ( derating of typ., max forward voltage, etc.) 4. please insert protective resistors into the circuit in order to stabilize led operation and to prevent the device from igniting due to excess current . 5. please avoid the stick of foreign material because molding resin in the products have adhesiveness. also please don't touch lens portion. 6. please check the actual performance in the assembly because the specification sheets are described for led device only. 7. please refrain from looking directly at the light source of led at high output, as it may harm your vision. 8. the products are designed to operate without failure in recommended usage conditions. however, please take the necessary precautions to prevent fire, injury, and other damages should any malfunction or failure arise . 9. the products are manufactured to be used for ordinary electronic equipment. please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on). 10. when there is a process of supersonic wave welding etc. after mounting the product, there is a possibility of affecting on the reliability of junction part in package (junction part of die bonding and wire bonding). please make sure there is no problem before using . 11. the formal specification sheets shall be valid only by exchange of documents signed by both parties. 2014/7/16 page : 10
vfhd1111c - 3b72b - tr page : 11 packaging specifications this product is baked (moisture removal) before packaging, and is shipped in moisture - proof packaging (as shown below) to minimize moisture absorption during transportation and storage. however, with regard to storing the products, stanley recommends the use of dry - box under the following conditions is recommended. moisture - proof bag as the packaging is made of anti - static material but packaging box is not. the package should not be opened until immediately prior to its use, and please keep the time frame between package opening and soldering as is maximum 1week(168h ) . if the device needs to be soldered twice, both soldering operations must be completed within the 4weeks(672h). if any components should remain unused, please reseal the package and store them under the conditions described in the recommended storage condition above . this product must be required to perform baking process (moisture removal) for at 10h ( min.). 12h(max .) at 60 5 degrees celsius if following conditions apply. 1. in the case of silica gel (blue) which indicates the moisture level within the package, changes or loses its blue color. 2 . in the case of time passes for 1week(168h ) after the package is opened once . baking process should be performed after led having been taken out of the package . baking may be performed in the tape - reel form , however if it is performed with the reel stacked over one another, it may cause deformation of the reels and taping materials and later obstruct mounting. please handle only once it has returned to room temperature. provided that, baking process shall be 2 times max. time elapsed after package opening 2014/7/16 page : 11 in the case of the package unopened , 6 months under recommended storage condition . please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. recommended storage condition / products warranty period temperature +5 30 humidity under 70%
vfhd1111c - 3b72b - tr page : 12 packaging specification moisture - proof packaging specification fastener for re - storage after opening bag customer's opening position product label (desiccant with indicator for moisture level is enclosed .) a 2014/7/16 page : 12 heat sealing position (after product being put in) allowable leaving time means the maximum allowable leaving time after opening package, which depends on each led type. the allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. when judging if the allowable leaving time has exceeded or not, please subtract the soldering time. the allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. flow chart - package opening to mounting sym. part name matelrial remarks moisture-proof bag with aluminum layer pet+al+pe with esd protection yes no yes no yes no baking led under recommended condition product mounting unused-product remained return to moisture-proof package and seal finished reopen the moisture-proof package flow chartpackage opening to mounting stored under recommended condition moisture-proof package first time opening allowable leaving time exceeded (*) discoloration of silica gel
vfhd1111c - 3b72b - tr page : 13 packing box ( rohs ? elv compliant) the above measure is all the reference value. the box is selected out of the above table by shipping quantity. packaging specifications b type a material / box cardboard c5bf type b,c material / box cardboard k5af partition cardboard k5af box type outline dimension l w h (mm) capacity of the box type a 280 265 45 (mm) 3 reels type b 310 235 265 (mm) 15 reels type c 440 310 265 (mm) 30 reels 2014/7/16 page : 13
vfhd1111c - 3b72b - tr page : 14 label specification ( acc.to jis - x0503(code - 39 ) product label a. parts number b . bar - code for parts number c. parts code (in - house identification code for each parts number) d. packed parts quantity e . bar - code for packed parts quantity f. lot number & rank (refer to lot number notational system for details ) g. bar - code for lot number & rank opto device label a. customer name b. parts type c. parts code d. parts number e. packed parts quantity f. carton number g. shipping date h. bar - code for in - house identification number bar - code font : acc.to code - 39(jix0503) packaging specifications b a 2014/7/16 page : 14
vfhd1111c - 3b72b - tr page : 15 taping and reel specifications (acc.to jis - c0806 - 03 appearance note " - tr" means cathode s ide of leds should be placed on the sprocket - hole side. items specifications remarks leader area cover - tape cover - tape shall be longer than 320mm without carrier - tape the end of cover - tape shall be held with adhesive tape. carrier - tape empty pocket shall be more than 20 pieces. please refer to the above figure for taping & reel orientation . trailer area empty pocket shall be more than 15 pieces. the end of taping shall be inserted into a slit of the hub. 2014/7/16 page : 15 direction to take out
vfhd1111c - 3b72b - tr page : 16 taping and reel specifications ( acc.to jis - c0806 - 03 qty. per reel mechanical strength others 4 ,000parts/reel minimum qty. per reel might be 500 parts when getting less than 4,000 parts. in such case, parts of 500 - unit - qty. shall be packed in a reel and the qty . shall be identified on the label. cover - tape adhesive strength shall be 0.1 1.0n ( an angle between carrier - tape and cover - tape shall be170 deg. ) both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. reversed - orientation, up - side down placing, side placing and out of spec. parts mixing shall not be held. max. qty. of empty pocket per reel shall be defined as follows. 2014/7/16 page : 16 qty./reel max. qty. of empty pocket remaks a 500 1 - 1,000 1 - 1,500 1 - 2,000 2 no continuance 2,500 2 no continuance 3,000 3 no continuance 3,500 3 no continuance 4,000 4 no continuance
vfhd1111c - 3b72b - tr taping dimensions reel dimensions page : 17 taping and reel specifications ( acc.to jis - c0806 - 03 2 1 3 unit mm 2014/7/16 page : 17 sym. part name remarks carrier-tape without esd protection cover-tape without esd protection with esd protection carrier-reel
vfhd1111c - 3b72b - tr page : 18 lot number notational system - 1digit production location (mark identify alphabet) - 1digit production year (last digit of production year 2009 9,2010 0,2011 1, ??? ) - 2digits production month (jan. to sep. , should be 01,02,03, ????? ) - 2digits production date - 3digits serial number - 2digits tape and reel following number - 2digits luminous intensity rank. (if luminous intensity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate .) - 2digits chromaticity rank ( if chromaticity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate.) - 1digit option rank ( stanley normally print " - " to indicate) 2014/7/16 page : 18
vfhd1111c - 3b72b - tr page : 19 correspondence to rohs ? elv instruction page : 19 this product is in compliance with rohs ? elv. prohibition substance and it's criteria value of rohs ? elv are as follows. ? rohs instruction refer to following (1) (6). ? elv instruction . refer to following (1) (4). substance group name criteria value (1) lead and its compounds 1,000ppm max (2) cadmium and its compounds 100ppm max (3) mercury and its compounds 1,000ppm max (4) hexavalent chromium 1,000ppm max (5) pbb 1,000ppm max (6) pbde 1,000ppm max 2014/7/16 page : 19
vfhd1111c - 3b72b - tr reliability testing result page : 20 2014/7/16 1. reliability testing result 2. failure criteria reliability testing result applicable standard testing conditions duration failure room temp. operating life eiaj ed- 4701/100(101) ta = 25 , i f = maxium rated current 1,000 h 0/25 resistance to soldering heat eiaj ed- 4701/300(301) pre-heating : 150 180 120s max. operation heating : 230 40s max. peak temperature : 260 twice 0/25 temperature cycling eiaj ed- 4701/100(105) minimum rated storage temperature(30min) normal temperature(15min) maximum rated storage temperature(30min) normal temperature(15min) 5 cycles 0/25 wet high temp. storage life eiaj ed- 4701/100(103) ta = 60 2 , rh = 90 5% 1,000 h 0/25 high temp. storage life eiaj ed- 4701/200(201) ta = maximum rated storage temperature 1,000 h 0/25 low temp. storage life eiaj ed- 4701/200(202) ta = minimum rated storage temperature 1,000 h 0/25 vibration, variable frequency eiaj ed- 4701/400(403) 98.1m/s 2 (10g), 100 2khz sweep for 20min., xyz each direction 2 h 0/10 items symbols conditions failure criteria luminous intensity iv i f value of each product luminous intensity testing min. value spec. min. value x 0.5 forward voltage v f i f value of each product forward voltage testing max. value R spec. max. value x 1.2 reverse current i r v r = maximum rated reverse voltage v testing max. value R spec. max. value x 2.5 cosmetic appearance - - occurrence of notable decoloration, deformation and cracking
vfhd1111c - 3b72b - tr special notice to customers using the products and technical information shown in this data sheet 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not constitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4 ) the products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument). the application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine , home appliance and measuring instrument. 5) in order to export the products or technologies described in this data sheet which are under the foreign exchange and foreign trade control law, it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http:// www.stanley - components.com/en/ 2014/7/16 page : 21

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